Precision Laser Scribing Alumina Substrate Factory |Alumina Plate

Laser Aluminum Oxide Plate Description

Due to the hard and fragile nature of ceramic materials, it is very difficult to prepare via holes, shape cutting or scribing. Traditional mechanical processing methods are time-consuming and labor-intensive, and there is stress during the processing, which can easily cause damage to the substrate. As a flexible, high-efficiency, and high-yield processing method, laser has demonstrated extraordinary capabilities in the processing of ceramic substrates.

Laser Oxidation Aluminum Plate Process

Forming: The alumina powder is mixed with binders and other additives and then shaped into the desired form through pressing or casting.
Sintering: The shaped component is sintered at high temperatures to achieve the desired density and mechanical properties.
Laser Cutting: Advanced laser cutting techniques are used to achieve precise dimensions and complex geometries with high accuracy. Laser cutting provides clean edges and reduces the need for additional finishing processes.

Laser Oxidation Aluminum Plate Specifications

Hole Size
Hole Diameter (mm)	Standard Tolerance (mm)
φ≤0.5	0.08
φ>0.5	0.2
Laser Scribing
Substrate Thickness (mm)	The Percentage Of Laser Scribe Line Depth to Thickness (%)
0.2-0.3	40%±5%
0.3	50%±3%
0.5	43%±3%
1.2	55%±3%
1.5	55%±3%
2	55%+10%
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

Package

Our aluminum oxide panels are carefully treated to prevent damage during storage and transportation, ensuring the product maintains its original high-quality condition.

What is laser scribing

Definition

Laser scribing is a technology that can easily separate ceramic substrates/circuits from manufactured panels/sheets. Unlike laser cutting, the laser beam does not pass completely through the material during laser scribing, the goal is to create a perforated line that allows for an easy, clean cut.

Essentially, in laser scribing, small (<30um) blind holes are drilled in straight lines, creating weak points in the material. These blind vias facilitate the subsequent breakthrough process. Importantly, your design does not need to account for spacing between different designs, as scribing will not affect the final dimensions of the part. The depth of the blind hole is less than half of the substrate.

Laser scribing is often used to prepare substrates for easy picking out after printing or assembly. This way, the party assembling the ceramic substrate doesn’t need expensive equipment, and you avoid any difficulties in cutting the ceramic later in the process, thereby avoiding the risk of damaging other components using a high-power/high-temperature laser.

When - how to use it (on your drawing)

Generally, we recommend using laser scribing to draw straight lines on the design outline and laser cutting to draw curves. Also, for inside corners, we recommend using laser cutting instead of scribing. Additionally, we recommend cutting (milling) rather than scoring when installing holes and slots inside the material. The thicker the material, the shorter the scribe lines need to be to ensure the design will stay properly within the panel and not break from handling or shipping

If you want to mark laser lines on a drawing, assign them to a separate layer (Mechanical, Manufacturing, or Graphics). This way, we know where to cut and where to draw. If you’re not sure how to do this, make sure the lines extend all the way to the edge of the panel. Let us complete your panel design. We’ll be happy to help.

Ordering Information

Order aluminum oxide sheets in required size and quantity. For bulk orders or custom requirements, please contact us for more details.

Laser Alumina Substrate